🤖 AI Summary
Training large language models (LLMs) on wafer-scale chips (WSCs) faces critical challenges: severe memory constraints, high tail latency induced by 2D mesh topology, intense on-wafer device-to-device (D2D) traffic contention, and exponential explosion of the tensor mapping search space. To address these, this paper proposes the Tensor Streaming Parallelism Paradigm (TSPP), the first topology- and traffic-aware end-to-end tensor parallel compilation and mapping framework tailored to WSC physical characteristics. TSPP introduces a joint topology–traffic optimization framework integrating topology-aware tensor sharding, analytical D2D traffic modeling, and a two-level solver—coarse-grained chip-level placement followed by fine-grained micro-op scheduling. Evaluated across multiple LLMs, TSPP achieves 1.7× average throughput improvement, significantly reduces tail latency and D2D congestion, and enables efficient training at kilo-GPU-equivalent scale.
📝 Abstract
Large language models (LLMs) demand significant memory and computation resources. Wafer-scale chips (WSCs) provide high computation power and die-to-die (D2D) bandwidth but face a unique trade-off between on-chip memory and compute resources due to limited wafer area. Therefore, tensor parallelism strategies for wafer should leverage communication advantages while maintaining memory efficiency to maximize WSC performance. However, existing approaches fail to address these challenges.
To address these challenges, we propose the tensor stream partition paradigm (TSPP), which reveals an opportunity to leverage WSCs' abundant communication bandwidth to alleviate stringent on-chip memory constraints. However, the 2D mesh topology of WSCs lacks long-distance and flexible interconnects, leading to three challenges: 1) severe tail latency, 2) prohibitive D2D traffic contention, and 3) intractable search time for optimal design.
We present TEMP, a framework for LLM training on WSCs that leverages topology-aware tensor-stream partition, traffic-conscious mapping, and dual-level wafer solving to overcome hardware constraints and parallelism challenges. These integrated approaches optimize memory efficiency and throughput, unlocking TSPP's full potential on WSCs. Evaluations show TEMP achieves 1.7x average throughput improvement over state-of-the-art LLM training systems across various models.