Problem
Research questions and friction points this paper is trying to address.
power delivery
3D heterogeneous integration
high power density
Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration
🤖 AI Summary
本文针对高密度和引脚数瓶颈导致的供电难题，提出设计多级分布式供电系统的方法，以支持复杂3D异构集成系统的可靠电力供应。
📝 Abstract
The demands of modern applications require the construction of ever more complex integrated systems, with AI applications in particular serving as a significant driver for increased system size, potentially going beyond the trilliontransistor mark. The path to building these systems requires the use of advanced packaging, with heterogeneous integrated 2D and 3D chiplets placed atop a substrate. Such computationally powerful systems require significant power for computation: reliable and robust power delivery is a major challenge in light of high power densities and pin count bottlenecks. This paper overviews approaches to building design methodologies that overcome this problem, through the design of multistage distributed power delivery systems, optimized for performance and reliability, and built to coexist within stringent performance, thermal, and reliability constraints.
Innovation
Methods, ideas, or system contributions that make the work stand out.
multi-kW power delivery
3D heterogeneous integration
high power density
distributed power delivery systems
reliability
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