NOVA: Technology-Architecture Co-Design of Near-Memory Processing for Attention-SSM-MoE Hybrid LLM Inference

2026-08-23

AI Summary

针对混合大型语言模型在近存处理中遇到的技术和架构难题，NOVA通过4F^2 DRAM单元与两层NMP架构相结合的方法，提高了存储密度和计算效率。

Abstract

The rapid evolution of hybrid large language models (LLMs), which interleave grouped-query-attention (GQA), state-space model (SSM), and Mixture-of-Experts (MoE) layers, introduces two fundamental challenges for near-memory processing (NMP) architectures. First, the Technology Wall: the conventional 6F^2 DRAM cell is approaching its physical scaling limits at 10nm-class nodes, making it difficult to meet the memory capacity demands of MoE models with hundreds of experts. Second, the Architecture Wall: existing NMP designs target narrow arithmetic intensity (Op/B) ranges and cannot efficiently support the heterogeneous compute characteristics of hybrid LLMs, spanning memory-bound SSM layers, compute-intensive GQA layers, and large Op/B variations across experts. We propose NOVA, a technology-architecture co-designed NMP system that overcomes both walls. On the technology side, NOVA combines a 4F^2 vertical channel transistor (VCT) DRAM cell with a peri-over-cell (POC) structure to achieve approximately 2x memory density at iso-area over conventional 6F^2-based DRAM, enabling continued scaling into sub-10nm nodes. On the architecture side, NOVA repurposes the POC peripheral-die (peri-die) to host processing units, forming a 2-tier NMP architecture: Tier-1 (peri-die NMP) for low-to-mid Op/B operations, and Tier-2 (base-die NMP) for mid-to-high Op/B operations. Parallel execution across tiers supports diverse compute patterns for hybrid LLMs, maximizing inference performance. Evaluated on state-of-the-art hybrid and MoE LLMs including Nemotron3-Nano, Nemotron3-Super, Falcon-H1R, and Qwen3, NOVA achieves on average 4.5x higher throughput, 69.8% lower end-to-end latency, and 5x better energy efficiency over a GPU baseline, with only 3.9% area overhead and no loss in memory capacity.

Problem

• Near-Memory Processing
• Large Language Models
• Technology Wall
• Architecture Wall
• Mixture-of-Experts

Innovation

• 4F^2 VCT DRAM
• peri-over-cell (POC)
• technology-architecture co-design
• 2-tier NMP architecture
• hybrid LLMs